|
简称 |
英文全称 |
中文解释 |
|
SMT |
Surface Mounted Technology |
表面贴装技术 |
|
SMD |
Surface Mount Device |
表面安装设备(元件) |
|
DIP |
Dual In-line Package |
双列直插封装 |
|
QFP |
Quad Flat Package |
四边引出扁平封装 |
|
PQFP |
Plastic Quad Flat Package |
塑料四边引出扁平封装 |
|
SQFP |
Shorten Quad Flat Package |
缩小型细引脚间距QFP |
|
BGA |
Ball Grid Array Package |
球栅阵列封装 |
|
PGA |
Pin Grid Array Package |
针栅阵列封装 |
|
CPGA |
Ceramic Pin Grid Array |
陶瓷针栅阵列矩阵 |
|
PLCC |
Plastic Leaded Chip Carrier |
塑料有引线芯片载体 |
|
CLCC |
Ceramic Leaded Chip Carrier |
塑料无引线芯片载体 |
|
SOP |
Small Outline Package |
小尺寸封装 |
|
TSOP |
Thin Small Outline Package |
薄小外形封装 |
|
SOT |
Small Outline Transistor |
小外形晶体管 |
|
SOJ |
Small Outline J-lead Package |
J形引线小外形封装 |
|
SOIC |
Small Outline Integrated Circuit Package |
小外形集成电路封装 |
|
MCM |
Multil Chip Carrier |
多芯片组件 |
|
MELF |
|
圆柱型无脚元件 |
|
D |
Diode |
二极管 |
|
R |
Resistor |
电阻 |
|
SOC |
System On Chip |
系统级芯片 |
|
CSP |
Chip Size Package |
芯片尺寸封装 |
|
COB |
Chip On Board |
板上芯片
|
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